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Capacity
PCB technical capacity parameter

Item Mass processing capability Small batch processing capability
Layer (Max.) 2-22 24-28
Type of the board material FR-4, high-TG , aluminum?base, Rogers, etc., F4, BT PTFE,PPO ,PPE ,
Rogers,etc E-65,ect
Compound pressed board 4 layers 6 layers 6 layers 8 layers(FR-4+Rogers)
Maximum Size 400mm X 700mm 500mm X 1000mm??
Outline Size Tolerance ±0.13mm ±0.10mm
V-CUT Deepness Tolerance +/- 0.15 mm (V-CUT) :+/- 0.1 mm (CNC V-CUT)
BoardThicknessRange 0.1mm--6.0mm 7.0--8.0mm
Board Thickness Tolerance( t≥0.8mm) ±8% ±5%
Board Thickness Tolerance (t<0.8mm) ±10% ±8%
Medium Thickness(Min) 0.065mm(RCC) 0.05mm
Minimum Line Width 0.075mm(3mil) 0.063mm(2.5mil)
Minimum Line Distance 0.075mm(3mil) 0.063mm(2.5mil)
Line Margin 0.2 mm(CNC) :0.30 mm (punch):0.50 mm (V-CUT)
Outer layer copper thickness 9um--140um 175um--210um
Inner layer copper thickness 9um--140um 175um--210um
Drill hole size (mechanical hole) 0.25mm--6.00mm 0.15mm--0.25mm
Finish Hole size (mechanical hole) 0.10mm--6.00mm 0.05mm--0.1mm
Hole size tolerance (mechanical hole) +/- 0.076 mm (normal hole) +/- 0.05 mm (fit-press hole) +0.1/-0.05 mm (punch hole)
Hole position deviation (mechanical hole) +/-0.075mm: (drill hole) : +/- 0.10 mm (punch hole) 0.050mm
Laser hole size 0.10mm (1+n+1;2+n+2) 0.075mm
Aspect Ratio 10:1 (drill hole size>0.2mm) 12:1(drill hole size>0.25mm)
Solder mask type sensitive green, yellow, black, MATT, blue, red ink,and peelable blue glue.
Minimum width of solder mask bridge 0.10mm 0.075mm
Minimum size of solder mask separation ring 0.05mm 0.025mm
Soldermask oil? plug hole diameter 0.25mm--0.60mm 0.6mm-0.70mm
Impedance tolerance ±10% (impedance>50ohm);±5ohm(impedance<50ohm) ±5% (impedance>50ohm)
Surface processing type HAL, plating nickel gold(soft gold/flash gold), thick & hard gold, chemical nickel gold,immersion tin,lead-free H.A.S.L, Entek,gold-finger,and selective surface processing.

PCBA technical capacity parameter

Main production equipment Lin1 Semi-auto printer +JUKIKE2050M + MV2C-A + MPA-3 + Taiji soldering machine(11 ZONES)
Lin2 Semi-auto printer +JUKIKE2050M + MV2C-A + MPA-3 + Gelin soldering machine (5 ZONES)
Lin3 SPP-G1 + JUKIKE2060CM + YV100XE + MPA 3 + FLEXTRONICS REFLOWER (5 ZONES)
Lin4

DEK ELA +JUKIKE2060CM +?YV100XE + MPA-3 + KELONG REFLOWER (8 ZONES)

Lin5

DEK ELA +YV100XE + YV100XE + 2060+ HELLER 1800W (8 ZONES)

Lin6

SPPD + TCM3500Z + HELLER 1800EXL(8 ZONES)

Line7 America PACEST350 BGA 2 sets of counter- repairing stations
LIne8 Bonding machines, ASM-AB599 ( 5 sets ) ASM-AB520(6 sets) ASM-510C(5sets)
SMT speed CHIP components SMT speed 0.3S/ pcs, max speed 0.16S/ pcs.
SMT     Smallest SMT components size can reach to 0201, accuracy can reach to 0.1mm. can SMT PLCC 、 QFP 、 BGA 、 CSP and so on,leg distance can reach 0.3mm。We have advanced technology in SMT supper-thin PCB, FPC gold finger and so on. Can SMT/DIP mixed SMT/DIP TFT, drive –engine, mobile main board, batteryprotection circuit and some other difficult products and components
    Small order manufacturing from pcb manufacture –material purchasing –SMT/DIP processing –testing/ package—7days of delivery.
Daily production capacity 7,000,000 points

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