Shenzhen VEC Technology Co., Ltd. was established in 2003 and is affiliated to Hong Kong Victoria Electronics Group. It is a one-stop electronic product intelligent manufacturing solution provider focusing on PCB and PCBA. With the new Internet thinking, it is committed to creating a benchmark for "intelligent manufacturing" in the PCB and PCBA industries, and has leapt from a traditional factory to a modern digital intelligent manufacturing platform. Focusing on the field of electronic circuits, it continues to extend its service scope, and its products cover PCB R&D design, circuit board batch/proofing services, SMT/DIP surface mounting, PCBA component procurement and matching orders and other related fields.
Dare to innovate and dare to break through. With the new Internet thinking, VEC builds a new model of intelligent manufacturing, supported by big data and cloud computing, and digitizes the entire production and sales process, realizing the sample manufacturing required for supporting customer R&D, extending to the batch operation required for mass production, and creating a new layout of modern digital intelligent manufacturing.
Based in Shenzhen, look at the world. The company is headquartered in Shenzhen Special Economic Zone, which gathers the world's wisdom. It has opened a PCB circuit board factory and a PCBA assembly factory, and opened a branch factory in Jiangxi. It has three major brands, including "VEC PCBA", "Victoria PCB" and "VEC Technology". It has nearly 500,000 customers in more than 200 countries and regions around the world. With high-quality products and perfect services, Vienchen Technology has successfully ranked among the top PCB and PCBA companies in the country, and has obvious competitive advantages.
Ten years of hard work, extraordinary achievements. Since its establishment, the company has always insisted on improving and perfecting production processes and technologies, striving to reach the international advanced level in the industry, investing in R&D funds and technical teams, and combining copper/aluminum substrates, high-precision boards, Rogers high-frequency boards and FPC soft boards. The board-making capabilities and special processes such as impedance, HDI blind burial, step boards, double-sided mixed-pressure copper/aluminum substrate thermal and electric separation, double-sided sandwich copper/aluminum substrate thermal and electric separation, etc., easily won the board-making capabilities and special processes that a number of similar manufacturers have failed to achieve, and brought customers better one-stop services.
Quality casts honor, and innovation wins the future. In the future, the company will increase its digitalization efforts, lead industry innovation with its keen industry sense, use electronic circuit manufacturing technology and efficient delivery speed to provide customers with better product and service experience, and strive to become a world-class enterprise that is "the world's leading electronic intelligent hardware manufacturing platform" and "digital smart factory in the electronic circuit industry"!