PCB Process Capability
|
Item |
Unit |
2024 |
|
|
Sample |
Mass Production |
||
|
Laminate suppliers |
|
EMC,NAN YA,SHENGY,ITEQ,KB,Rogers,Taconic |
|
|
Laminate type |
|
Mid Tg / High Tg / BT-like / Normal Dk / Low Dk / Low loss |
|
|
Laminate Tg |
|
Tg150 /Tg170 /Tg180 |
|
|
Min core thickness |
mm |
0.05 |
0.05 |
|
Min Prepreg style |
mm |
1017 |
1017 |
|
Min board thickness (10-layer HDI) |
mm |
0.62 |
0.65 |
|
Min board thickness (12-layer HDI) |
mm |
0.72 |
0.75 |
|
HDI type |
|
1+N+1 ~ 14 ELIC |
|
|
mechanical drilling |
unit |
|
|
|
Min Hole Diameter |
mm |
0.15 |
0.2 |
|
Min annular ring |
mm |
0.075 |
0.01 |
|
Laser drilling |
unit |
|
|
|
Min Hole Diameter (CO2) |
mm |
0.05 |
0.075 |
|
Min annular ring |
mm |
0.05 |
0.056 |
|
Min line width / spacing |
unit |
|
|
|
Innerlayer (core) |
um |
40/40 |
40/50 |
|
Secondary outerlayer / outerlayer (Cu plating layer) |
|
40/50 |
45/50 |
|
Impedance |
unit |
|
|
|
Impedance tolerance |
ohm |
≥50ohms，±8% < 50ohms，±4ohm |
≥50ohms，±10% < 50ohms，±5ohm |
|
Solder mask/Surface treatment |
unit |
|
|
|
Soldermask registration |
mm |
0.025 |
0.0375 |
|
Min soldermask bridge(working draft) |
mm |
0.05 |
0.064 |
|
Solder mask color |
|
green,blue,black,white,yellow |
|
|
Surface finish |
|
HASL,LF HASL,ENIG,ENIG+OSP,ENEPIG,Immersion Silver,OSP,Immersion Tin,Gold Finger(Selective Heavy Hard Gold),Selective Heavy Soft Gold |
|
FPC Process Capability
|
item |
unit |
2024 |
|
|
Model |
batch production |
||
|
Base material supplier |
|
DOOSHAN，THINFLEX，ITEQ，SHENG YI |
|
|
type |
|
Halogen-Free |
|
|
Laminate Tg |
|
TG150，TG170 |
|
|
Min board thickness (Double-sided) |
mm |
0.1 |
0.10 |
|
Coverlay supplier |
|
DONGYI，OMAR，SHENG YI |
|
|
PP |
|
DOOSHAN，WAZAM，SHENG YI |
|
|
Min board thickness(Rigid-flex) |
mm |
0.3 |
0.33 |
|
mechanical drilling |
unit |
|
|
|
Min Hole Diameter |
mm |
0.1 |
0.15 |
|
Min annular ring |
mm |
0.075 |
0.1 |
|
Laser drilling(UV) |
unit |
|
|
|
Min Hole Diameter |
mm |
0.04 |
0.05 |
|
Min annular ring |
mm |
0.05 |
0.075 |
|
Laser drilling (CO2) |
unit |
|
|
|
Min Hole Diameter |
mm |
0.07 |
0.08 |
|
Min annular ring |
mm |
0.05 |
0.05 |
|
Min line width / spacing |
unit |
|
|
|
Inner layer (whole panel) |
um |
40/40 |
45/45 |
|
plating layer (whole panel) |
um |
40/50 |
50/50 |
|
impedance |
unit |
|
|
|
impedance |
ohm |
±8% |
±10% |
|
Soldermask/Surface finish |
unit |
|
|
|
Solder mask registration |
mm |
0.03 |
0.04 |
|
Min Solder mask Bridge |
mm |
0.06 |
0.075 |
|
Solder mask color |
|
green,blue,black,white,yellow |
|
|
Surface finish |
|
ENIG，ENIG+OSP，ENEPIG，Immersion Silver，OSP |
|
Sam
Bubble
Christine
Christine
Bubble