FPC Capability

Capability

FPC Process Capability

item

unit

2024

Model

batch production

Base material supplier

 

DOOSHAN,THINFLEX,ITEQ,SHENG YI

type

 

Halogen-Free

Laminate Tg

 

TG150,TG170

Min board thickness (Double-sided)

mm

0.1

0.10

Coverlay supplier

 

DONGYI,OMAR,SHENG YI

PP

 

DOOSHAN,WAZAM,SHENG YI

Min board thickness(Rigid-flex)

mm

0.3

0.33

mechanical drilling

unit

 

Min Hole Diameter

mm

0.1

0.15

Min annular ring

mm

0.075

0.1

Laser drilling(UV)

unit

 

Min Hole Diameter

mm

0.04

0.05

Min annular ring

mm

0.05

0.075

Laser drilling (CO2)

unit

 

Min Hole Diameter

mm

0.07

0.08

Min annular ring

mm

0.05

0.05

Min line width / spacing

unit

 

Inner layer (whole panel)

um

40/40

45/45

plating layer (whole panel)

um

40/50

50/50

impedance

unit

 

impedance

ohm

±8%

±10%

Soldermask/Surface finish

unit

 

Solder mask registration

mm

0.03

0.04

Min Solder mask Bridge

mm

0.06

0.075

Solder mask color/Coverlay

 

green,blue,black,white,yellow

Surface finish

 

ENIG,ENIG+OSP,ENEPIG,Immersion Silver,OSP