High layers Count HDI Gold Finger Card PCB (22 Layers)
Parameters
Layers count: 22L,Finished Board Thickness 3.2 mm
Min drilling hole dia: 0.25mm
Line Width/Space: 3.5/3.5mil
Special Process: Back drilling, Controlled depth,HDI(3+16+3),Any Layer,Impedance Control,High TG170 material,Gold Finger Plated Heavy Gold and Hard Gold
Application: Communications
Layers count: 22L,Finished Board Thickness 3.2 mm
Min drilling hole dia: 0.25mm
Line Width/Space: 3.5/3.5mil
Special Process: Back drilling, Controlled depth,HDI(3+16+3),Any Layer,Impedance Control,High TG170 material,Gold Finger Plated Heavy Gold and Hard Gold
Application: Communications
Details
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