8L RO4350B Mixed Pressure High Frequency PCB
parameter
Material: RO4350B+TU768 Mixed Pressure High Frequency
Layer number: 8 Layer thickness: 2.0 ± 0.1mm
Minimum aperture: Mechanical hole 0.2mm,
Minimum line width/spacing: 0.35mm
Copper thickness: 1OZ for all inner and outer layers
Solder mask: green / silk screen: white
Surface technology: immersion gold
Application field: High end 5G signal testing
Material: RO4350B+TU768 Mixed Pressure High Frequency
Layer number: 8 Layer thickness: 2.0 ± 0.1mm
Minimum aperture: Mechanical hole 0.2mm,
Minimum line width/spacing: 0.35mm
Copper thickness: 1OZ for all inner and outer layers
Solder mask: green / silk screen: white
Surface technology: immersion gold
Application field: High end 5G signal testing
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