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Multilayers ENIG Board (12 Layers)
Parameters Layers count: 12L Min drilling hole dia: 0.20mm Line Width/Space: 3.5/4mil Special Process: Via in PAD,Copper inlaid Application: Conmmunications
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4L OSP PCB (4 layers)
Parameters Layers count: 4L Min drilling hole dia: 0.20mm Line Width/Space: 4/4mil Special Process: BGA,Impedance Control,Surface finished: BGA OSP Application: Consumer electronics
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6Layers Purple PCB
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