FPC Process Capability
|
item |
unit |
2024 |
|
|
Model |
batch production |
||
|
Base material supplier |
|
DOOSHAN，THINFLEX，ITEQ，SHENG YI |
|
|
type |
|
Halogen-Free |
|
|
Laminate Tg |
|
TG150，TG170 |
|
|
Min board thickness (Double-sided) |
mm |
0.1 |
0.10 |
|
Coverlay supplier |
|
DONGYI，OMAR，SHENG YI |
|
|
PP |
|
DOOSHAN，WAZAM，SHENG YI |
|
|
Min board thickness(Rigid-flex) |
mm |
0.3 |
0.33 |
|
mechanical drilling |
unit |
|
|
|
Min Hole Diameter |
mm |
0.1 |
0.15 |
|
Min annular ring |
mm |
0.075 |
0.1 |
|
Laser drilling(UV) |
unit |
|
|
|
Min Hole Diameter |
mm |
0.04 |
0.05 |
|
Min annular ring |
mm |
0.05 |
0.075 |
|
Laser drilling (CO2) |
unit |
|
|
|
Min Hole Diameter |
mm |
0.07 |
0.08 |
|
Min annular ring |
mm |
0.05 |
0.05 |
|
Min line width / spacing |
unit |
|
|
|
Inner layer (whole panel) |
um |
40/40 |
45/45 |
|
plating layer (whole panel) |
um |
40/50 |
50/50 |
|
impedance |
unit |
|
|
|
impedance |
ohm |
±8% |
±10% |
|
Soldermask/Surface finish |
unit |
|
|
|
Solder mask registration |
mm |
0.03 |
0.04 |
|
Min Solder mask Bridge |
mm |
0.06 |
0.075 |
|
Solder mask color/Coverlay |
|
green,blue,black,white,yellow |
|
|
Surface finish |
|
ENIG，ENIG+OSP，ENEPIG，Immersion Silver，OSP |
|
Sam
Bubble
Christine